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PU Potting Compound – Clear, Anti-Yellowing, UL94-V2 Encapsulant for LED Applications BZ-211

PU Potting Compound – Clear, Anti-Yellowing, UL94-V2 Encapsulant for LED Applications BZ-211

Product Details:
Place of Origin: China
Brand Name: BZ-Bai Zhuang
Certification: UL File: QMFZ2.E352175
Model Number: 211
Document: BZ-211 _ UL Product iQ.pdf
Detail Information
Place of Origin:
China
Brand Name:
BZ-Bai Zhuang
Certification:
UL File: QMFZ2.E352175
Model Number:
211
Product Name:
PU Potting Compound
Mixing Ratio:
1:1
Hardness:
Shore 55A
Curing Condition:
Room Temperature Or Heated
Operatingtemperaturerange:
-40°C To 120°C
Thermalconductivity:
0.2 W/m·K
Moistureresistance:
Excellent
Weather Resistance:
High
Highlight:

High Light

Highlight:

clear PU potting compound

,

anti-yellowing PU encapsulant

,

UL94-V2 LED potting compound

Trading Information
Minimum Order Quantity:
200KG
Price:
$18, Or Negotiable
Packaging Details:
Curing agent 211 A for 5kg; Resin agent 211 B for 5kg
Delivery Time:
7 working days after payment
Payment Terms:
T/T,D/P,D/A,L/C
Supply Ability:
1000 Tons per Month
Product Description

Product Description

BZ-211 is a flame-retardant, optically transparent two-component polyurethane system formulated for LED strips, linear luminaires, and sensor modules. It offers dependable fire protection and stable dimensional behavior over a wide temperature window, safeguarding sensitive electronics against moisture, dust, and thermal cycling while preserving long-term optical and mechanical performance.

Key Product Features

  1. High-clarity, moderate-viscosity formulation: supports bubble-free encapsulation through manual or automated dispensing.
  2. Globally compliant: RoHS and REACH ready for smooth cross-border trade.
  3. Superior weatherability: resists aging and UV exposure, with minimal yellowing after 3–5 years of outdoor service.
  4. UL94 V-2 rated (QMFZ2.E352175): delivers recognized flame-retardant reliability.
  5. Excellent flexibility and flex endurance: withstands repeated bending without cracking.
  6. Tailored for LED lighting: well-suited for strip encapsulation, linear fixture coating, and compact sensor potting.

Technical Parameters

Parameters Hardener
BZ-211A
Resin
BZ-211B
Before curing Appearance Clear liquid Clear liquid
Viscosity(cps.25℃) 5000±1500 1600±400
Initial mixed viscosity(cps.25℃) 2000±1000
Density(g/cm³.25℃) 1.11±0.05 1.03±0.05
Mixing
&
Curing
Mix ratio(by weight) A:B=1:1
Pot life 130±30g(min.25℃) 25-40min
Curing condition Room temperature curing
Surface drying time 30g(H.25℃) 6-10
Curing time 30g(H.25℃) 12-16
Curing time 30g(Heated) Heated curing isn’t advised
After curing Hardness (Shore A) 55±5
Temperature resistance(℃) -40~85℃
Water absorption(24H) ≤1.0%
Surface resistivity (Ω/sq) ≥1.0*1012
Volume resistivity (Ω.cm) ≥1.0*1012
Tensile strength(MPa) ≥3
Elongation at break(%) ≥100%
Dielectric constant(at 50Hz) ≥8
Breakdown voltage(kV/mm) ≥14
Product Image 1

Product Applications

  1. LED Flexible Strip Light – Clear encapsulation with V2 flame retardance, flex-resistant with no adhesive delamination.
  2. LED Outdoor Luminaire – V2-rated fire safety and anti-yellowing for 3+ years outdoors, plus robust waterproof sealing.
  3. Sensor Module – Transparent, flexible potting that shrugs off thermal shock and humidity, performing stably across varied operating conditions.

Directions for Use

  1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc.
  2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
  3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
  4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
  5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
  6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
  7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
  8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

Packing

  1. Hardener: Typically 5KG/ 10KG / 20KG/ 200KG metal or plastic drums.
  2. Resin: Typically 5KG/ 10KG / 20KG / 200KG metal or plastic drums.

FAQ

Q1: What are the main features of the Weather-Resistant Transparent Polyurethane Potting Compounds?

A1: This potting compound offers excellent weather resistance, high transparency, strong adhesion, and durability, making it ideal for protecting electronic components from moisture, dust, and environmental damage.

Q2: Can this potting compound be used for outdoor electronic applications?

A2: Yes, the weather-resistant properties of this transparent polyurethane potting compound make it suitable for outdoor use, providing protection against UV rays, rain, and temperature fluctuations.

Q3: Is the compound easy to apply and cure?

A3: Yes, the potting compound has good flow characteristics for easy application and typically cures at room temperature, forming a tough and flexible protective layer.

Q4: Does the transparent nature of the compound affect its protective qualities?

A4: No, the transparency of the polyurethane potting compound does not compromise its protective features; it still provides excellent insulation and environmental protection while allowing visual inspection of the encapsulated components.

Q5: What types of electronics are compatible with this potting compound?

A5: It is compatible with a wide range of electronic components, including circuit boards, sensors, connectors, and LED assemblies, especially those requiring clear encapsulation and protection from harsh environmental conditions.

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