Home > Products >
Polyurethane Potting Compounds
>
Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

Product Details:
Place of Origin: China
Brand Name: Bai Zhuang
Certification: UL File: E352175
Model Number: BZ-6807(WT)
Detail Information
Place of Origin:
China
Brand Name:
Bai Zhuang
Certification:
UL File: E352175
Model Number:
BZ-6807(WT)
Product Name:
Polyurethane Potting Compounds
Color:
White
Material Type:
Polyurethane
Hardness:
ShoreD 40 To 60
Thermal Conductivity:
0.6 W/m·K
Application:
Potting And Encapsulation Of Electronic Components
Mix Ratio:
1:5 (by Weight)
Dielectric Strength:
18 To 25 KV/mm
Operating Temperaturerange:
-40°C To 130°C
Waterproof:
IP67
Highlight:

High Light

Highlight:

Encapsulated Polyurethane Potting Compounds

,

Electronic Components Polyurethane Potting Compounds

,

Encapsulated potting material for pcb

Trading Information
Minimum Order Quantity:
600KG
Price:
Negotiable
Packaging Details:
Curing agent 6807 A for 5kg/10kg; Resin agent 6807 B for 25KG/200KG
Delivery Time:
7 working days after payment
Payment Terms:
T/T,L/C,D/A,D/P
Supply Ability:
1000 Tons per Month
Product Description

Heat-Resistant Polyurethane Potting Compound with Excellent Electrical Properties                                                                                                           

Product Description


BZ-6807(WT) is a white, heat-resistant polyurethane potting material featuring V0-grade flame retardancy and RTI 130°C thermal endurance. It delivers strong electrical and mechanical performance, making it ideal for potting power modules, control boards, sensors, and general power electronic devices.

 

Key Product Features

  1. Two-part black system, easy to dispense manually or with automated equipment;
  2. Excellent flow and permeability for smooth, bubble-free filling;
  3. RoHS and REACH compliant, supporting hassle-free global logistics;
  4. UL94 V-0 flame rating and RTI-130°C heat resistance (UL Yellow Card: QMFZ2.E352175);
  5. Strong adhesion to substrates, with proven durability under thermal cycling and humid conditions;
  6. Reliable electrical insulation and consistent mechanical robustness.​


Technical Parameters 

Parameters

Hardener

BZ-6807WT A

Resin

BZ-6807WT B

 

Before curing

Appearance

Brown liquid

White liquid

Viscosity(cps.25℃)

100-250

3000-5500

Initial mixed viscosity(cps.25℃)

1300±300

Density(g/cm³.25℃)

1.21±0.05

1.53±0.05

 

Mixing

&

Curing

 

 

Mix ratio(by weight)

A:B=1:5

Pot life 130±30g(min.25℃)

35±10

Curing condition

Room temperature curing

Surface drying time 30g(H.25℃)

3.5-5.5 H

Curing time 30g(H.25℃)

5-10 H

Curing time(Heated)

60℃ heated 1H

 

 

After curing

 

Color

White

Hardness (Shore D)

50±10

Temperature resistance(℃)

-40~130

Flame retardancy UL94

(Vertical burning)

 

V0

Thermal conductivity(W/m.k)

≥0.50

Water absorption(24H)

0.1%

Surface resistivity(Ω/sq)

≥1.0×1013

Volume resistivity(Ω.cm)

≥1.0×1013

Tensile strength(MPa)

≥3

Dielectric constant(at 50Hz)

≥6

Breakdown voltage(kV/mm)

20

Average Linear Coefficient of Thermal Expansion

149×10-6K-1

Comparative Tracking Index (CTI)

Ⅰ/600V


Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

Product Applications


  1. Automotive Electronics: Excellent Electrical Performance, Vibration Resistance, Flame Retardant V0 Class, Heat Stability and Reliability
  2. Low-altitude aircraft: Low density can be combined with lightweight design, flexible materials, and waterproof IP68
  3. Sensor: low density, flame-retardant V0, low dielectric constant, and low-temperature resistant;
  4. Industrial controllers and control boards: Excellent high-temperature resistance, compliant with RTI 130 temperature rating standards, featuring high thermal conductivity and heat dissipation capabilities, with V0-class fire resistance.
  5. Other electronic products: Flame-retardant V0, UL Yellow Card, compliant with RTI 130 temperature resistance standard. Their outstanding electrical and mechanical properties meet most electronic products' requirements for high-performance materials.



Directions for Use

  1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
  2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
  3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
  4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
  5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
  6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
  7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
  8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.


Packing

  1. Hardener: Typically 5KG/10KG/25KG/200KG metal or plastic drums.
  2. Resin: Typically 25KG/200KG metal or plastic drums.

    Conductivity Thermal Potting Compound Silicone For Transformer ODM BZ-3900-N1.5 1