Home > Products >
Polyurethane Potting Compounds
>
Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

Product Details:
Place of Origin: China
Brand Name: Bai Zhuang
Certification: UL File: E352175
Model Number: BZ-6807(WT)
Detail Information
Place of Origin:
China
Brand Name:
Bai Zhuang
Certification:
UL File: E352175
Model Number:
BZ-6807(WT)
Product Name:
Polyurethane Potting Compounds
Color:
White
Material Type:
Polyurethane
Hardness:
ShoreD 40 To 60
Thermal Conductivity:
0.6 W/m·K
Application:
Potting And Encapsulation Of Electronic Components
Mix Ratio:
1:5 (by Weight)
Dielectric Strength:
18 To 25 KV/mm
Operating Temperaturerange:
-40°C To 130°C
Waterproof:
IP67
Highlight:

High Light

Highlight:

Encapsulated Polyurethane Potting Compounds

,

Electronic Components Polyurethane Potting Compounds

,

Encapsulated potting material for pcb

Trading Information
Minimum Order Quantity:
600KG
Price:
Negotiable
Packaging Details:
Curing agent 6807 A for 5kg/10kg; Resin agent 6807 B for 25KG/200KG
Delivery Time:
7 working days after payment
Payment Terms:
T/T,L/C,D/A,D/P
Supply Ability:
1000 Tons per Month
Product Description

Heat-resistant Excellent Electrical Properties Polyurethane Potting Compounds                                                                                                           

Product Description

 

BZ-6807(WT) Polyurethane potting compound  is a white, heat-resistant, high-performance flame-retardant V0-grade polyurethane. This polyurethane boasts excellent electrical and mechanical properties, meeting the RTI 130°C heat resistance standard. It effectively fulfills the performance requirements for potting compounds in power modules, control boards, sensors, and general power electronic devices.

 

Key Product Features

  1. Two-part black polyurethane features a straightforward, hassle-free dispensing process. Boasting superior fluidity and permeability, it enables effortless pouring—compatible with both manual application and automated machinery.​
  2. Compliant with RoHS, REACH, and other eco-friendly standards, this product facilitates smooth international shipments. It meets the criteria for UL94-V0 flame retardancy and RTI-130℃ heat resistance, with UL Yellow Card Number: QMFZ2.E352175.​
  3. Offering strong adhesive properties, outstanding resistance to extreme temperatures and harsh weather conditions, the product also delivers exceptional electrical insulation and reliable mechanical performance.​

 

Technical Parameters 

Parameters

Hardener

BZ-6807WT A

Resin

BZ-6807WT B

 

Before curing

Appearance

Brown liquid

White liquid

Viscosity(cps.25℃)

100-250

3000-5500

Initial mixed viscosity(cps.25℃)

1300±300

Density(g/cm³.25℃)

1.21±0.05

1.53±0.05

 

Mixing

&

Curing

 

 

Mix ratio(by weight)

A:B=1:5

Pot life 130±30g(min.25℃)

35±10

Curing condition

Room temperature curing

Surface drying time 30g(H.25℃)

3.5-5.5 H

Curing time 30g(H.25℃)

5-10 H

Curing time(Heated)

60℃ heated 1H

 

 

After curing

 

Color

White

Hardness (Shore D)

50±10

Temperature resistance(℃)

-40~130

Flame retardancy UL94

(Vertical burning)

 

V0

Thermal conductivity(W/m.k)

≥0.50

Water absorption(24H)

0.1%

Surface resistivity(Ω/sq)

≥1.0×1013

Volume resistivity(Ω.cm)

≥1.0×1013

Tensile strength(MPa)

≥3

Dielectric constant(at 50Hz)

≥6

Breakdown voltage(kV/mm)

20

Average Linear Coefficient of Thermal Expansion

149×10-6K-1

Comparative Tracking Index (CTI)

Ⅰ/600V

Product Applications

 

  1. Automotive Electronics: Excellent Electrical Performance, Vibration Resistance, Flame Retardant V0 Class, Heat Stability and Reliability
  2. Low-altitude aircraft: Low density can be combined with lightweight design, flexible materials, and waterproof IP68
  3. Sensor: low density, flame-retardant V0, low dielectric constant, and low-temperature resistant;
  4. Industrial controllers and control boards: Excellent high-temperature resistance, compliant with RTI 130 temperature rating standards, featuring high thermal conductivity and heat dissipation capabilities, with V0-class fire resistance.
  5. Other electronic products: Flame-retardant V0, UL Yellow Card, compliant with RTI 130 temperature resistance standard. Their outstanding electrical and mechanical properties meet most electronic products' requirements for high-performance materials.

 

 

Directions for Use

  1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
  2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
  3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
  4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
  5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
  6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
  7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
  8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

 

Packing & Shipping & Storage

  1. Hardener: Typically 5KG/10KG/25KG/200KG metal or plastic drums.
  2. Resin: Typically 25KG/200KG metal or plastic drums.
  3. Store and transport as a general chemical product.
  4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
  5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

    Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 0Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 1Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 2Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 3Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 4Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 5Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 6Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 7Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT 8