| Place of Origin: | China |
| Brand Name: | Bai Zhuang |
| Certification: | UL File: QMFZ2.E352175 |
| Model Number: | BZ-3900 |
| Document: | 3900 _ UL Product iQ.pdf |
The BZ-3900 is a UL94-V0 high-performance electronic potting compound. As a silicone-based material, it cures into an elastomer with a temperature range of-60 to 220°C, high thermal conductivity, and excellent high-frequency electrical performance. It also provides repairability to mitigate mechanical stress and tension caused by thermal shock and vibration, enabling your electronic products to operate stably in harsh environments.
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Parameters |
Part A BZ-3900 |
Part B BZ-3900 |
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|
Before curing |
Appearance |
Grey liquid |
Milky white liquid |
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Viscosity(cps.25℃) |
2000±500 |
2000±500 |
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Initial mixed viscosity(cps.25℃) |
2000±500 |
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Density(g/cm³.25℃) |
1.56±0.05 |
1.56±0.05 |
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Mixing & Curing
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Mix ratio(by weight) |
A:B=1:1 |
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Pot life 130±30g(min.25℃) |
45±15 |
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Curing condition |
Room temperature curing |
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Surface drying time 30g(min.25℃) |
60-120min |
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Curing time 30g(H.25℃) |
3-6H |
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After curing
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Color |
Grey |
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Hardness (Shore A) |
48±8A |
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Temperature resistance(℃) |
-60~220℃ |
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Water absorption(24H) |
≤0.5% |
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Surface resistivity(Ω/sq) |
≥1.0×1014 |
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Volume resistivity(Ω.cm) |
≥1.0×1013 |
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Elongation at break(%) |
≥60% |
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Dielectric constant(at 50Hz) |
≤3.5 |
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Breakdown voltage(kV/mm) |
≥20 |
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Thermal conductivity(w/m.k) |
≥0.8 |
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Flame retardancy UL94 |
V0(1.5mm) |
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9. This series of products are room-temperature-curing, addition-cure two-component silicone. During the dispensing process, avoid contact with the following three types of materials to prevent reactions that may affect the curing effect:
a. Organotin compounds and organotin-containing silicone rubber.
b. Sulfur, sulfides, and sulfur-containing materials.
c. Amine compounds and amine-containing materials.
10. It should be noted that during manual operation, when vacuumizing the mixed A+B adhesive, the vacuum pressure must be controlled to ensure the adhesive is not completely sucked out of the container by the vacuum.
Q1: What are the primary applications of High-Performance Silicone Potting Compounds?
A1: High-Performance Silicone Potting Compounds are widely used for protecting electronic components, sensors, and circuit boards from moisture, dust, vibration, and thermal shock. They are ideal for automotive, aerospace, and industrial electronics applications.
Q2: What temperature range can High-Performance Silicone Potting Compounds withstand?
A2: These silicone potting compounds typically withstand a broad temperature range, from approximately -60°C to +220°C, making them suitable for extreme environmental conditions.
Q3: Are these silicone potting compounds electrically insulating?
A3: Yes, High-Performance Silicone Potting Compounds provide excellent electrical insulation, helping to prevent short circuits and ensuring reliable performance of electronic assemblies.
Q4: How is the curing process performed for these silicone potting compounds?
A4: The curing process can vary depending on the specific formulation but generally involves room temperature curing or heat curing. They typically cure to a solid elastomer within hours to a day, providing durable protection.
Q5: Are High-Performance Silicone Potting Compounds resistant to chemicals and moisture?
A5: Yes, these compounds exhibit strong resistance to moisture, water, and various chemicals, which helps enhance the longevity and reliability of the encapsulated components.
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