BZ-3801 is a two-component room-temperature-curing condensation-type silicone potting compound engineered specifically for high-power LED lighting systems, featuring ultra-soft flexibility, balanced working time, and dual-color options (white/black). With wide temperature tolerance (-50~180℃) and RoHS compliance, it provides exceptional protection against thermal stress, vibration, and moisture for high-power LED drivers, control modules, and heat-sensitive components. As a condensation-curing product, its cross-linking reaction requires atmospheric moisture—critical operational note: potted high-power assemblies must not be hermetically sealed immediately after pouring, as this will trap moisture and cause incomplete curing, compromising heat dissipation and long-term reliability.
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Parameters |
Part A BZ-3801 |
Part B BZ-3801 |
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Before curing |
Appearance |
White/ Black liquid |
Clear liquid |
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Viscosity(mPa·s.25℃) |
1500-3000 |
45-55 |
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Initial mixed viscosity(mPa·s.25℃) |
800-1300 |
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Density(g/cm³.25℃) |
1.22±0.05 |
0.95±0.05 |
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Mixing & Curing
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Mix ratio(by weight) |
A:B=10:1 |
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Pot life 130±30g(min.25℃) |
50±15 |
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Curing condition |
Room temperature curing |
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Surface drying time 30g(H.25℃) |
1H-3H |
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Curing time 30g(H.25℃) |
2.5H-5H |
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After curing
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Color |
White/ Black |
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Hardness (Shore A) |
15A-30A |
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Temperature resistance(℃) |
-50~180℃ |
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Water absorption(24H) |
≤0.5% |
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Surface resistivity(Ω/sq) |
≥1.0×1014 |
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Volume resistivity(Ω.cm) |
≥1.0×1013 |
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Elongation at break(%) |
≥60% |
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Dielectric constant(at 50Hz) |
≤5 |
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Breakdown voltage(kV/mm) |
≥15 |
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BZ-3801 utilizes a condensation curing mechanism that depends on ambient moisture for complete cross-linking—critical for high-power LED performance: