BZ-3900-N1.5: 1.5 W/m·K High Thermal Conductivity Silicone Potting Compound

Product Description

BZ-3900-N1.5 is a two-component addition-cure silicone potting compound optimized for high-power electronic systems requiring enhanced heat dissipation. With a thermal conductivity rating of ≥1.5 W/m·K, UL94 V0 flame retardancy, and wide temperature tolerance, it delivers reliable insulation, mechanical stability, and corrosion resistance for components operating in extreme conditions. This versatile compound is suitable for manual and automated dispensing processes, ensuring uniform encapsulation of complex electronic assemblies.

Key Product Features

1. 1.5 W/m·K Thermal Conductivity: Provides superior heat transfer efficiency, ideal for power-dense applications like high-capacity battery packs, industrial inverters, and high-performance LED drivers.
   2. Wide Temperature Range: Maintains stable performance from -60°C to 250°C, withstanding thermal shock in harsh industrial, automotive, and outdoor environments.
   3. UL94 V0 Flame Retardancy: Achieves V0 rating at 3mm thickness, offering critical fire safety for energy storage systems and power modules.
   4.Controlled Flowability: Mixed viscosity of 5000–6000 mPa·s balances deep penetration into intricate components with reduced dripping during vertical applications.
   5. Superior Environmental Protection: Resists moisture (≤3% absorption in 24 hours), UV radiation, ozone, and chemical corrosion, ensuring long-term reliability in humid or corrosive environments.
   6.High Electrical Insulation: Offers volume resistivity ≥1.0×10¹⁶ Ω·cm and breakdown voltage ≥27 kV/mm, protecting components from electrical arcing and short circuits.

Technical Parameters 

Product Applications

1.  High-Density Energy Storage: Encapsulates large-format battery packs and energy storage systems in electric vehicles, grid-scale storage, and backup power solutions.
   2. Industrial Power Electronics: Protects high-power inverters, converters, and motor drives in heavy machinery, renewable energy plants, and industrial automation systems.
   3. High-Performance LED Lighting: Provides thermal management for stadium lighting, automotive headlights, and high-brightness display modules requiring efficient heat dissipation.
   4. Aerospace & Defense Electronics: Ensures reliable operation of avionics, radar systems, and communication equipment in extreme temperature and pressure conditions.
   5. Telecommunications Infrastructure: Encapsulates base station power amplifiers and signal processing modules to maintain performance in remote or outdoor locations.

Directions for Use

1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

   9. This series of products are room-temperature-curing, addition-cure two-component silicone. During the dispensing process, avoid contact with the following three types of materials to prevent reactions that may affect the curing effect:

       a. Organotin compounds and organotin-containing silicone rubber.

       b. Sulfur, sulfides, and sulfur-containing materials.

       c. Amine compounds and amine-containing materials.

     10. It should be noted that during manual operation, when vacuumizing the mixed A+B adhesive, the vacuum pressure must be controlled to ensure the adhesive is not completely sucked out of the container by the vacuum.

Packing & Shipping & Storage

1. Part A: Typically supplied in 25kg sealed plastic drums.
2. Part B: Typically supplied in 25kg sealed plastic drums.
3. Store and transport as a general chemical product.
4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

FAQ:

Q1: What are Thermal Conductive Adhesive Compounds used for?

A1: Thermal Conductive Adhesive Compounds are used to bond components while efficiently transferring heat away from sensitive electronic parts, ensuring optimal thermal management in devices such as LEDs, CPUs, and power modules.

Q2: What materials can Thermal Conductive Adhesive Compounds bond?

A2: These compounds can bond a variety of materials including metals, ceramics, plastics, and electronic components, providing strong adhesion along with excellent thermal conductivity.

Q3: How do Thermal Conductive Adhesive Compounds improve device performance?

A3: By facilitating efficient heat dissipation from heat-generating components, these adhesives prevent overheating, improve reliability, and extend the lifespan of electronic devices.

Q4: Are Thermal Conductive Adhesive Compounds electrically conductive?

A4: Most Thermal Conductive Adhesive Compounds are electrically insulating to prevent short circuits, while still offering high thermal conductivity to manage heat effectively.

Q5: What is the typical curing process for Thermal Conductive Adhesive Compounds?

A5: The curing process varies by product, but generally involves room temperature curing or heat curing at elevated temperatures to achieve optimal adhesion and thermal performance.