BZ-3900-G2.0: 2.0 W/m·K High Thermal Conductivity Silicone Potting Compound                                 

Product Description

BZ-3900-G2.0 is a high-performance two-component addition-cure silicone potting compound designed for extreme heat dissipation requirements in power-dense electronic systems. With a thermal conductivity rating of ≥2.0 W/m·K, low water absorption, and UL94 V0 flame retardancy, it provides exceptional thermal management, electrical insulation, and environmental protection for components operating in harsh conditions. This compound balances flowability with high density, making it suitable for both manual and automated dispensing processes.

Key Product Features

1. 2.0 W/m·K Thermal Conductivity: Delivers industry-leading heat transfer efficiency, ideal for high-power applications like ultra-fast charging battery packs and industrial power converters.
   2. Ultra-Low Water Absorption: ≤1% absorption in 24 hours ensures reliable performance in humid or marine environments, preventing corrosion and electrical failure.
   3. Wide Temperature Range: Maintains stable properties from -60°C to 250°C, withstanding extreme thermal shock in aerospace, automotive, and industrial applications.
   4. UL94 V0 Flame Retardancy: Achieves V0 rating at 3mm thickness, providing critical fire safety for energy storage systems and high-voltage power modules.
   5. Controlled Flowability: Mixed viscosity of 5000–7500 mPa·s allows deep penetration into intricate components while minimizing dripping during vertical applications.
   6.High Density: 2.6–2.7 g/cm³ ensures excellent contact with heat-generating surfaces, maximizing heat transfer efficiency in compact designs.

Technical Parameters 

Product Applications

1.Ultra-Fast Charging Systems: Encapsulates high-power charging stations, battery management systems (BMS), and fast-charging modules in electric vehicles.
2.Industrial Power Electronics: Protects high-voltage inverters, rectifiers, and frequency converters in heavy machinery, renewable energy plants, and data centers.
3.Aerospace & Defense Electronics: Ensures reliable operation of avionics, radar systems, and satellite components in extreme temperature and pressure conditions.
4.High-Performance LED Lighting: Provides thermal management for stadium lighting, automotive headlights, and projection systems requiring efficient heat dissipation.
5.Marine & Offshore Electronics: Protects sensors, communication equipment, and power distribution systems in saltwater environments with high humidity and corrosion risks.

Directions for Use

1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

   9. This series of products are room-temperature-curing, addition-cure two-component silicone. During the dispensing process, avoid contact with the following three types of materials to prevent reactions that may affect the curing effect:

       a. Organotin compounds and organotin-containing silicone rubber.

       b. Sulfur, sulfides, and sulfur-containing materials.

       c. Amine compounds and amine-containing materials.

     10. It should be noted that during manual operation, when vacuumizing the mixed A+B adhesive, the vacuum pressure must be controlled to ensure the adhesive is not completely sucked out of the container by the vacuum.

Packing & Shipping & Storage

1. Part A: Typically supplied in 25kg sealed plastic drums.
2. Part B: Typically supplied in 25kg sealed plastic drums.
3. Store and transport as a general chemical product.
4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

FAQ:

Q1: What are Thermal Conductive Adhesive Compounds used for?

A1: Thermal Conductive Adhesive Compounds are used to bond components while efficiently transferring heat away from sensitive electronic parts, ensuring optimal thermal management in devices such as LEDs, CPUs, and power modules.

Q2: What materials can Thermal Conductive Adhesive Compounds bond?

A2: These compounds can bond a variety of materials including metals, ceramics, plastics, and electronic components, providing strong adhesion along with excellent thermal conductivity.

Q3: How do Thermal Conductive Adhesive Compounds improve device performance?

A3: By facilitating efficient heat dissipation from heat-generating components, these adhesives prevent overheating, improve reliability, and extend the lifespan of electronic devices.

Q4: Are Thermal Conductive Adhesive Compounds electrically conductive?

A4: Most Thermal Conductive Adhesive Compounds are electrically insulating to prevent short circuits, while still offering high thermal conductivity to manage heat effectively.

Q5: What is the typical curing process for Thermal Conductive Adhesive Compounds?

A5: The curing process varies by product, but generally involves room temperature curing or heat curing at elevated temperatures to achieve optimal adhesion and thermal performance.