BZ-3900-G2.5: 2.5 W/m·K High Thermal Conductivity Silicone Potting Compound                                

Product Description

BZ-3900-G2.5 is a heavy-duty two-component addition-cure silicone potting compound engineered for extreme heat dissipation in high-power electronic systems. With a thermal conductivity rating of ≥2.5 W/m·K, ultra-low water absorption, and UL94 V0 flame retardancy, it provides exceptional thermal management, mechanical stability, and environmental protection for components operating in harsh conditions. This high-density compound is designed for applications requiring maximum heat transfer efficiency in compact spaces.

Key Product Features

1. 2.5 W/m·K Thermal Conductivity: Delivers industry-leading heat transfer performance, ideal for ultra-high-power applications like grid-scale energy storage and industrial frequency converters.
   2. Ultra-Low Water Absorption: ≤1% absorption in 24 hours ensures reliable performance in humid, marine, or underground environments, preventing corrosion and electrical failure.
   3. Extreme Temperature Resistance: Maintains stable properties from -60°C to 250°C, withstanding thermal shock in aerospace, automotive, and deep-sea applications.
   4. UL94 V0 Flame Retardancy: Achieves V0 rating at 3mm thickness, providing critical fire safety for high-voltage power modules and energy storage systems.
   5. High Density: 3.05 g/cm³ ensures intimate contact with heat-generating surfaces, maximizing heat transfer efficiency in compact, power-dense designs.
   6. Excellent Mechanical Strength: Shore A hardness of 55–65 provides robust protection against vibration, impact, and mechanical stress in industrial and automotive applications.

Technical Parameters 

Product Applications

1.Grid-Scale Energy Storage: Encapsulates large-format battery packs and energy storage systems in power grids, ensuring efficient heat dissipation and fire safety.
Industrial Power Electronics: Protects high-voltage inverters, rectifiers, and motor drives in heavy machinery, steel mills, and renewable energy plants.
2. Aerospace & Defense Electronics: Ensures reliable operation of avionics, radar systems, and satellite components in extreme temperature and pressure conditions.
3.Deep-Sea Exploration Equipment: Protects sensors, communication systems, and power modules in subsea vehicles and offshore drilling platforms with high pressure and humidity.
4. High-Power LED Lighting: Provides thermal management for stadium lighting, projection systems, and high-brightness display modules requiring efficient heat dissipation.

Directions for Use

1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

   9. This series of products are room-temperature-curing, addition-cure two-component silicone. During the dispensing process, avoid contact with the following three types of materials to prevent reactions that may affect the curing effect:

       a. Organotin compounds and organotin-containing silicone rubber.

       b. Sulfur, sulfides, and sulfur-containing materials.

       c. Amine compounds and amine-containing materials.

     10. It should be noted that during manual operation, when vacuumizing the mixed A+B adhesive, the vacuum pressure must be controlled to ensure the adhesive is not completely sucked out of the container by the vacuum.

Packing & Shipping & Storage

1. Part A: Typically supplied in 25kg sealed plastic drums.
2. Part B: Typically supplied in 25kg sealed plastic drums.
3. Store and transport as a general chemical product.
4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

FAQ:

Q1: What are Thermal Conductive Adhesive Compounds used for?

A1: Thermal Conductive Adhesive Compounds are used to bond components while efficiently transferring heat away from sensitive electronic parts, ensuring optimal thermal management in devices such as LEDs, CPUs, and power modules.

Q2: What materials can Thermal Conductive Adhesive Compounds bond?

A2: These compounds can bond a variety of materials including metals, ceramics, plastics, and electronic components, providing strong adhesion along with excellent thermal conductivity.

Q3: How do Thermal Conductive Adhesive Compounds improve device performance?

A3: By facilitating efficient heat dissipation from heat-generating components, these adhesives prevent overheating, improve reliability, and extend the lifespan of electronic devices.

Q4: Are Thermal Conductive Adhesive Compounds electrically conductive?

A4: Most Thermal Conductive Adhesive Compounds are electrically insulating to prevent short circuits, while still offering high thermal conductivity to manage heat effectively.

Q5: What is the typical curing process for Thermal Conductive Adhesive Compounds?

A5: The curing process varies by product, but generally involves room temperature curing or heat curing at elevated temperatures to achieve optimal adhesion and thermal performance.